Evaluation system makes continuous measurement of resistance changes due to solder cracking under temperature stress/shock.
Detects changes in insulation resistance on circuit boards due to humidity/moisture induced dendrites.
Evaluates electromigration under high temperatures (max. 400°C) and current stress.
Applies DC current, pulsed current, and AC pulsed current under high temperatures to measure and evaluate increasing resistance and leak current caused by electromigration.
Precisely measures low-k insulation-film leak-current. Indispensable for process evaluation at temperatures as high as 350°C.
Improving the pattern generator and driver allows burn-in of a variety of devices.
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