Evaluation system makes continuous measurement of resistance changes due to solder cracking under temperature stress/shock.
Detects changes in insulation resistance on circuit boards due to humidity/moisture induced dendrites.
Evaluates electromigration under high temperatures (max. 400°C) and current stress.
Applies DC current, pulsed current, and AC pulsed current under high temperatures to measure and evaluate increasing resistance and leak current caused by electromigration.
Precisely measures low-k insulation-film leak-current. Indispensable for process evaluation at temperatures as high as 350°C.
Improving the pattern generator and driver allows burn-in of a variety of devices.
ESPEC North America expands its Criterion benchtop line to include a 4 cu. ft. temp./humidity model.
ESPEC will be exhibiting at the Photovoltaic Technology Show 2010 in San Francisco! Contact us for your FREE ticket today!
Upgrade your new or existing ESPEC SCP-220 controller with Ethernet/LAN access. Check out the new Web Controller, try the live demo, and request a quote!