Evaluation system makes continuous measurement of resistance changes due to solder cracking under temperature stress/shock.
Detects changes in insulation resistance on circuit boards due to humidity/moisture induced dendrites.
Evaluates electromigration under high temperatures (max. 400°C) and current stress.
Applies DC current, pulsed current, and AC pulsed current under high temperatures to measure and evaluate increasing resistance and leak current caused by electromigration.
Precisely measures low-k insulation-film leak-current. Indispensable for process evaluation at temperatures as high as 350°C.
Improving the pattern generator and driver allows burn-in of a variety of devices.
In anticipation of the InterSolar show, ESPEC has posted a joint press release announcing the sale of a unique solar simulator chamber to WESTPAK.
ESPEC will be exhibiting at InterSolar North America 2010 in San Francisco! Contact us for your FREE ticket today!
ESPEC will be exhibiting at Intersolar (co-located with Semicon West) this coming July in San Francisco.