Chamber FAQ
An Analysis of Solder Cracking Mechanisms
This report looks at one cause of solder cracking?the roughening of the solder grain boundary field?and verifies the relation of the problem to both thermal and mechanical stress. The results indicate that the solder grain boundary experiences roughening from both types of stress, although thermal stress exerts the greater influence. Degradation of solder strength due to roughening was also confirmed.
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Friday, July 09 2010
In anticipation of the InterSolar show, ESPEC has posted a joint press release announcing the sale of a unique solar simulator chamber to WESTPAK.
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