Chamber FAQ
Confirming Reliability of Printed Circuit Boards with Temperature Cycle and Thermal Shock
In this report, to confirm the effects of heat stress on PCB through holes, we performed the Temperature Cycle Test (air chamber method) and the Thermal Shock Test (liquid bath method). As a result, we found a strong relationship between solder cracking and the life of the copper-plated through hole. In addition, we shall report on our confirmation of the mechanism leading to that failure life.
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From espec.com
- Solar Simulator sold to WestPak Lab
Friday, July 09 2010
In anticipation of the InterSolar show, ESPEC has posted a joint press release announcing the sale of a unique solar simulator chamber to WESTPAK.
- Join us at InterSolar North America 2010 for FREE
Thursday, June 10 2010
ESPEC will be exhibiting at InterSolar North America 2010 in San Francisco! Contact us for your FREE ticket today!
- ESPEC at Intersolar / Semicon West
Wednesday, May 05 2010
ESPEC will be exhibiting at Intersolar (co-located with Semicon West) this coming July in San Francisco.
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