Chamber FAQ
Confirming Reliability of Printed Circuit Boards with Temperature Cycle and Thermal Shock
In this report, to confirm the effects of heat stress on PCB through holes, we performed the Temperature Cycle Test (air chamber method) and the Thermal Shock Test (liquid bath method). As a result, we found a strong relationship between solder cracking and the life of the copper-plated through hole. In addition, we shall report on our confirmation of the mechanism leading to that failure life.
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