Chamber FAQ
Evaluating the Bonding and Insulation Characteristics of Conductive Adhesives
The advantages of low-temperature mounting and environmentally friendly attributes have propelled conductive adhesives to the forefront in thes earch for next-generation mounting technology to replace conventional solder mounting. The widespread interest in this technology has led us to prepare this report studying the reliability of conductive adhesives. We ran temperature cycle tests to evaluate the bonding characteristics of these adhesives, and we ran humidity and ionic migration (also known as electrochemical migration) tests to evaluate insulation reliability. The results we obtained under these experimental conditions indicate that conductive adhesives offer both bonding reliability and insulation reliability on a par with the reliability of conventional.
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Friday, July 09 2010
In anticipation of the InterSolar show, ESPEC has posted a joint press release announcing the sale of a unique solar simulator chamber to WESTPAK.
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Thursday, June 10 2010
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Wednesday, May 05 2010
ESPEC will be exhibiting at Intersolar (co-located with Semicon West) this coming July in San Francisco.
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