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Evaluating the CAF (conductive anodic filament) resistance of multi-layered PWBs
Advances in the high-density wiring of electronic parts have been accompanied by insulation degradation stemming from ion migration, creating serious problems. While a great deal of research has been carried out investigating the formation of dendrites, which are one form of ion migration, there has been a noticeable lack of clarification of the role of CAF (conductive anodic filament) formation. As a result, we decided to evaluate the CAF resistance of multi-layered PWBs (printed wiring boards). We investigated the relationship between the shape of the CAF that formed and the behavior of insulation resistance levels during CAF formation. We found that during CAF formation the insulation resistance levels repeatedly dropped temporarily and then recovered. In addition, we observed a substance presumed to be CAF at the sites of probable insulation degradation, and we were able to confirm that this substance occurred along the glass fibers.
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