Retrieving data from high-density points requires high sensitivity, which GMR heads, (unlike conventional MR heads), attain mainly through the use of spin-valve structure. However, ensuring heat resistance with spin-valve GMR heads can be problematic, and the head manufacturers are seeking for improvements by developing superior heat resistant heads. As hard disk memory density is now increasing in extremely short cycles, the problem facing manufacturers is to somehow evaluate new devices quickly.
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In anticipation of the InterSolar show, ESPEC has posted a joint press release announcing the sale of a unique solar simulator chamber to WESTPAK.
ESPEC will be exhibiting at InterSolar North America 2010 in San Francisco! Contact us for your FREE ticket today!
ESPEC will be exhibiting at Intersolar (co-located with Semicon West) this coming July in San Francisco.