ESPEC
Measurement & Evaluation Test Systems
Chamber FAQ
The Effect of Ramp Rate on Temperature Cycle Fatigue in Solder Joints
Following the enactment of international standards, unprecedented attention has become focused on the ramp rate of Temperature Cycle Tests. We have performed comparative testing to determine the life and failure mode of solder joints, investigating solder joints used on BGA and QFP packages.
Latest News
From espec.com
- Solar Simulator sold to WestPak Lab
Friday, July 09 2010
In anticipation of the InterSolar show, ESPEC has posted a joint press release announcing the sale of a unique solar simulator chamber to WESTPAK.
- Join us at InterSolar North America 2010 for FREE
Thursday, June 10 2010
ESPEC will be exhibiting at InterSolar North America 2010 in San Francisco! Contact us for your FREE ticket today!
- ESPEC at Intersolar / Semicon West
Wednesday, May 05 2010
ESPEC will be exhibiting at Intersolar (co-located with Semicon West) this coming July in San Francisco.
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