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Using the EIS method to analyze the reaction mechanisms of the ionic migration process in solder materials

Electrochemical impedance spectroscopy (EIS) is attracting attention as an effective method of analyzing electrode interfacial reactions. In this method, a minute AC sine wave signal is overlapped onto a DC signal. The resultant reaction characteristics are then used to analyze the reaction mechanisms. For this report, we used the EIS method to analyze the reaction mechanisms of the migration process in solder materials. The results of this study indicate that the process of ionic migration (also known as electrochemical migration) involves a charge transfer process and a mass transfer process. By monitoring changes in the characteristic values, ionic migration characteristics can be assigned to each type of solder material and used to predict the likelihood of migration occurrence.

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