Conductor Resistance Evaluation System (AMR Series)

Printed Wiring Board Conductor Resistance Evaluation System

The Printed Wiring Board Conductor Resistance Evaluation System, Solder Joint Evaluation System enables continuous measurement of resistance changes under high and low temperature Cycle. Automatic measurement, data storage and processing are operated systematically with a PC. Graphic display of data, compatibility with spreadsheet software, dataprocessing via LAN, are some of the features for realizing accurate and effective contact reliability evaluation.

Features

High precision measurement
Resistance changes in solder joints and connector joints can be measured continuously under a low/high temperature cycle environment.

Wide measurement range of 10-3 to 106Ω
With a 4-terminal measurement method, minute resistance changes are accurately measured at the end of the cable.

Global environmental awareness
Components are mounted by lead-free soldering. In addition, power consumption is reduced by 28%* (in comparison with the previous model) in consideration of global environmental problems. *except for purchased items such as PCs and measuring instruments.

Applications

• PB-free solder connectivity evaluation
• BGA and CSP solder ball connectivity evaluation
• Connectivity evaluation of electrically conductive adhesive and anisotropic conductive film
• Contact resistance evaluation of connector
• Contact resistance evaluation of switch and relay
• Chip capacitor connectivity evaluation
• Connectivity evaluation of dissimilar metal

Specifications

Model	AMR-040-P
Resistance measuring range	1 x 10-3 1 to 106 Ω (at measurement cable terminal)
Measurement intervals	Min. 3 sec. (10 channels), can be changed at 3 sec. steps
Measuring range	1Ω, 10Ω, 100Ω, 1kΩ, 10kΩ, 100kΩ and AUTO range (each channel is measured by an optimum range.)
Measurement current	DC10mA, 1mA, 100μA, 10μA
No. of measurement channels	40 channels (standard), (Max. 280 channels)

Specifications are subject to change without notice for design improvement.