Electromigration testing at 1µA, 400°C
Increasing use is being made of microfabrication and new materials in order to increase the levels of performance and integration achieved with semiconductor devices. And as the operating life of devices depends on microfabrication and such new materials, it has become increasingly important to evaluate electromigration under high-precision life-acceleration conditions.High-precision control is used for the temperature (max. 400°C) and current stress that form the main factors in this life acceleration. A Black's model equation and analytical software have been provided to determine product life.
Easy operation
DUT boards can be removed and inserted individually. By inserting Dummy boards instead, Oven can maintain test temperature without large disturbance. It enables you to continue the test. Notice: To use a heatproof glove.
Newly developed highly reliable Board and Socket
Newly developed highly reliable board and socket have "Double Contact" configuration (patent pending), enabling the connecting parts between the DUT boards and DUT sockets to be fixed firmly. In addition, a unique ESPEC arrangement is used to ensure proper connection between the DUTs and DUT sockets. This new design dramatically reduces faulty contacts at high temperatures and provides low-cost, high-cost-performance DUT boards capable of conducting testing for longer periods than previously possible.

| Type of evaluation |
|
|
|---|---|---|
| Stress-current | Output range | +1µA to +50mA DC |
| Accuracy | 1µA to 1 mA: ±(0.2% of S.V.+1µA) 1.01mA to 50mA: ±(0.2% of S.V. +25µA) |
|
| Follow voltage | 35V | |
| Extrusion test voltage | Output range | -10V to +20V |
| Accuracy | ±(2% of setting +20mV) | |
| Oven | Temperature range | +65 to +400°C |
| Temperature fluctuation | ±0.5°C (+65 to +350°C) | |
| Temperature Uniformity | ±2.5°C (+65 to +350°C) | |
| accessory | N2 gas inlet | |
| Model | AEM-240C3 AAA |
AEM-160C2 0AA |
AEM-080C1 00A |
|
|---|---|---|---|---|
| EM module output current | Oven 1 | 50mA | 50mA | 50mA |
| Oven 2 | 50mA | 50mA | - | |
| Oven 3 | 50mA | - | - | |
| Number of test channels | 240ch | 160ch | 80ch | |
| DUT board | Number of board | 24 (8 x 3 ovens) | 16 (8 x 2 ovens) | 8 |
| IC sockets | 5 sockets/board (both DIP 28-pin 600 mil and DIP 28-pin 300 mil) | |||
| Power supply | 200V AC 3φ 50/60Hz (cabinet), 100V AC 1φ 50/60Hz (PC unit) | |||
| Power consumption | Cabinet | Max. 10kW | Max. 7kW | Max. 4kW |
| PC unit | 350W | |||
| Cabinet dimensions (mm) | 580 x 1220 x 1945 | 580 x 1220 x 1490 | ||
| PC rack dimensions (mm) | 680 x 640 x 1260 | |||