1) LSI Pattern evaluation
Increase of Current Density.
New material due to overcome of Delay in Multi-level Interconnect.
2) Solder Bump EM Evaluation
Increase of Current Density.
Contact evaluation in Flip Chip mounting.
3) Specification
100TEG / Chamber
350 0C (400 0C)
Leak detection and measurement
100ƒÊA to
